Paper Title:
Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices
  Abstract

Indium antimony(InSb) is one of the important materials which can be used to make semiconductor devices such as infrared detection device. Due to the low hardness and great brittleness, the surface scratching always appears and surface roughness is hard to lower during surface preparation. So it should be increasing the InSb surface quality during ultra precision machining. In this paper the InSb surface adsorption-control technology was introduced. Through controlling surface roughness during chemical mechanical polishing(CMP) and using preferential adsorption during cleaning, the adsorptions of InSb surface were controlled. Through experiments, the CMP optimal process parameters under the alkaline conditions were gotten. Under such conditions, the preferable surface state was realized. According to the preferential adsorption model, through using FA/O non-ionic surfactant the polished wafer surface can be kept in physical adsorption and easy cleaning state, so the wafer surface adsorption can be controlled effectively and the clean surface was obtained.

  Info
Periodical
Advanced Materials Research (Volumes 183-185)
Chapter
Environmental Biotechnology
Edited by
Yanguo Shi and Jinlong Zuo
Pages
1137-1140
DOI
10.4028/www.scientific.net/AMR.183-185.1137
Citation
X. H. Niu, Y. G. He, B. H. Gao, B. M. Tan, Y. L. Liu, "Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices", Advanced Materials Research, Vols. 183-185, pp. 1137-1140, 2011
Online since
January 2011
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Price
$32.00
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