In this work, the effect of plating temperature on the electroless plating rate and the properties of the electroless Ni-Cu-P deposits was studied. The corrosion resistance, hardness, surface morphology and components of the coating were studied by using electrochemical workstation, digital micro-hardness SEM and EDS. The results show that the optimum plating temperature is 75°C. The deposition rate, hardness and corrosion resistance are all good when the optimal temperature is 75°C. The adhesion between the deposits and the matrix is better. The deposits is smooth and uniformity, smooth by SEM. The deposit contains Ni 77.80%, Cu 7.68%, P 14.52% by the analyses of energy disperse X-ray.