Paper Title:
Study on the Effect of Ultrasonic Waves on the Low Temperature Electroless Ni-P Plating on Copper Substrate
  Abstract

In this paper,electroless Ni-P plating on copper substrate at 50 °C in ultrasonic field was carried out. The frequency of ultrasonic waves was 40 kHz. The effect of ultrasonic on the composition, plating rate and morphology of Ni-P deposite was investigated at the ultrasonic power of 40, 70 and 100 W. The experimental results showed Ni-P deposit could not be obtained without ultrasonic field at 50 °C. The content of nickel and the thickness of Ni-P deposit increased with the ultrasonic waves power increase. Ultrasonic irradiation power remarkably refines the nodule size of Ni-P particles. The collapse of cavities in solution seems to suppress the Z-direction growth of the nodule.

  Info
Periodical
Advanced Materials Research (Volumes 189-193)
Edited by
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
Pages
1142-1145
DOI
10.4028/www.scientific.net/AMR.189-193.1142
Citation
Y. J. Hu, G. H. Hu, X. L. Cheng, X. T. Xiao, H. Y. Zhang, F. Li, Q. S. Xu, "Study on the Effect of Ultrasonic Waves on the Low Temperature Electroless Ni-P Plating on Copper Substrate", Advanced Materials Research, Vols. 189-193, pp. 1142-1145, 2011
Online since
February 2011
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Price
$32.00
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