Paper Title:
Study on Intelligent Analysis of the Causes of SMT Solder Joint Defects Based on Fuzzy Neural Network
  Abstract

By determining membership function of the input parameters and selecting defuzzification method, the evaluation model which can be used to intelligent analyzing the causes of SMT solder joint defects was set up. The fuzzy neural network was trained by using the output variables of the training samples from intelligent discrimination as the input variables of training samples of fuzzy neural network. The fuzzy neural network was tested by using the output variables of the testing samples from intelligent discrimination as the input variables of testing samples of fuzzy neural network. The results show that by using the evaluation model the cause of SMT solder joint defects can be analyzed intelligently and the results of intelligently analysis are reasonable, the evaluation model can be used practically.

  Info
Periodical
Advanced Materials Research (Volumes 189-193)
Edited by
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
Pages
3257-3261
DOI
10.4028/www.scientific.net/AMR.189-193.3257
Citation
C. Y. Huang, H. G. Wei, T. M. Li, D. J. Yan, "Study on Intelligent Analysis of the Causes of SMT Solder Joint Defects Based on Fuzzy Neural Network", Advanced Materials Research, Vols. 189-193, pp. 3257-3261, 2011
Online since
February 2011
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Price
$32.00
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