Paper Title:
Formation and Growth of Intermetallic Compound Layers at Interface of Solder/Copper Alloys for Lead Frame
  Abstract

The effect of chemical species of copper alloys on growth of intermetallic compounds (IMCs) at interface of solder/copper alloys for lead frame was investigated. The results have revealed that Cu is the main diffusing species during aging. After aged at 160°C for 300h, only a Cu6Sn5 IMC layer is observed at SnPb/copper alloys interfaces. The growth rate of IMC on the Cu-Cr-Zr system alloys and Cu-Ni-Si alloys was much slower than that of IMC on the C19400 alloy. The Pb phase and voids were found to be inside the Cu6Sn5 phase. Chromium, one of the alloying element in Cu-Cr-Zr-Zn alloys, has found to be segregated at the interface between the copper alloy/Cu6Sn5. Zn and Zr in the Cu-Cr-Zr-Zn system alloy are enriched in small amout inside the IMC. These observed results were discussed and analysed on the baisis of diffusion and growth kinetics.

  Info
Periodical
Advanced Materials Research (Volumes 189-193)
Edited by
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
Pages
3383-3390
DOI
10.4028/www.scientific.net/AMR.189-193.3383
Citation
F. X. Huang, P. Yin, C. T. Li, J. C. Li, "Formation and Growth of Intermetallic Compound Layers at Interface of Solder/Copper Alloys for Lead Frame", Advanced Materials Research, Vols. 189-193, pp. 3383-3390, 2011
Online since
February 2011
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