Paper Title:
Stress Distribution of Bonded Joint with Rubbery Adhesives
  Abstract

This paper deals with the stress distribution in adhesively bonded joints with rubbery adhesives. The 3-D finite element analysis (FEA) software was used to model the joint and predict the stress distribution along the whole joint. The FEA results indicated that there are stress discontinuities existing in the stress distribution within the adhesive layer and adherends at the lower interface and the upper interface of the boded section for most of the stress components. The FEA results also show that the stress field in the whole joint is dominated by the normal stresses components S11, S33 and the shear stress component S13. The features and variations of these critical stresses components are discussed.

  Info
Periodical
Advanced Materials Research (Volumes 189-193)
Edited by
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
Pages
3427-3430
DOI
10.4028/www.scientific.net/AMR.189-193.3427
Citation
X. C. He, "Stress Distribution of Bonded Joint with Rubbery Adhesives", Advanced Materials Research, Vols. 189-193, pp. 3427-3430, 2011
Online since
February 2011
Authors
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Price
$32.00
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