Paper Title:
Numerical Simulation on Splat-Quenched CuCr25 Alloys
  Abstract

The numerical simulation model of rapid solidification splat-quenching CuCr25 alloys was built in this paper. The vacuum chamber, cooling cooper plate and sample were taken into account as a holistic heat system. Based on the heat transfer theory and liquid solidification theory, the heat transfer during the rapids solidification process of CuCr25 flakes prepared by splat-quenching can be approximately modeled by one-dimensional heat conduction equation, so that the temperature distribution and the cooling rate of the flake can be determined by the integration of this equation. The simulative results are coincident very well with the experimental results for the microstructure of rapid solidification splat-quenched CuCr25 alloys.

  Info
Periodical
Advanced Materials Research (Volumes 189-193)
Edited by
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
Pages
3949-3953
DOI
10.4028/www.scientific.net/AMR.189-193.3949
Citation
Z. M. Zhou, B. B. Lei, L. W. Tang, T. Zhou, Y. Hu, M. M. Cao, "Numerical Simulation on Splat-Quenched CuCr25 Alloys", Advanced Materials Research, Vols. 189-193, pp. 3949-3953, 2011
Online since
February 2011
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Price
$32.00
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