Paper Title:
Effect of Operated Parameters on Removal Rate and Surface Roughness in Precision Atomization Ultra-Polishing Process of Copper Surface
  Abstract

Compared with the traditional chemical mechanical polishing (CMP) technique, the precision atomization ultra-polishing (PAUP) technology has the advantages of friendly environmental and damage-free. This paper established a novel PAUP tester based on the atmospheric pressure theory, and explored the possibility of PAUP technique. Furthermore, effects of operated parameters on the material removal rate and surface roughness were investigated in PAUP process. It was found that a material removal rate of 78.302 nm/min was obtained with a surface roughness of 0.015 µm at the optimal parameters. This study provides insight into the development of the novel ultra-polishing methods and its underlying theoretical foundation.

  Info
Periodical
Advanced Materials Research (Volumes 189-193)
Edited by
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
Pages
4141-4144
DOI
10.4028/www.scientific.net/AMR.189-193.4141
Citation
Q. Z. Li, Y. G. Wang, Z. X. Guo, D. M. Guo, "Effect of Operated Parameters on Removal Rate and Surface Roughness in Precision Atomization Ultra-Polishing Process of Copper Surface", Advanced Materials Research, Vols. 189-193, pp. 4141-4144, 2011
Online since
February 2011
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Price
$32.00
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