Paper Title:
Effect of a Thin Cr Layer on the Microstructures and Fracture Behaviours of Copper Films
  Abstract

An investigation on Cu/Cr/Si composite thin films demonstrated that a thin Cr layer affects the microstructures and mechanical behavior of Cu films significantly. The fracture modes changes from brittle fracture to ductile rupture, as indicated by the dimpled rupture of Cu films. Moreover, the Cr sticking layer can result in carrot-shaped rods and a fine grain size. Further analysis indicates their deformation and fracture processes are closely related to the coupling of dislocation-mediated plasticity as well as the formation and growth of voids which act as sites for nucleation of the dimples.

  Info
Periodical
Advanced Materials Research (Volumes 194-196)
Edited by
Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang
Pages
2376-2379
DOI
10.4028/www.scientific.net/AMR.194-196.2376
Citation
H. L. Sun, Z. X. Song, F. Ma, K. W. Xu, "Effect of a Thin Cr Layer on the Microstructures and Fracture Behaviours of Copper Films", Advanced Materials Research, Vols. 194-196, pp. 2376-2379, 2011
Online since
February 2011
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$32.00
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