Paper Title:
Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films
  Abstract

Polymer-based conductive adhesive materials have become widely used in many electronic packaging interconnect applications. In this paper, a new kind of polymer-based conductive particle used in anisotropic conductive adhesive films (ACFs) is prepared. The preparation of the single scattered polystyrene spheres with the particle size of 3 microns around and the less than 5% dispersion coefficient is done successfully, and a layer of nickel is coated on the surface of polystyrene spheres using chemical plating method well.

  Info
Periodical
Advanced Materials Research (Volumes 194-196)
Edited by
Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang
Pages
643-647
DOI
10.4028/www.scientific.net/AMR.194-196.643
Citation
J. Ma, H. Gao, X. Chen, "Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films", Advanced Materials Research, Vols. 194-196, pp. 643-647, 2011
Online since
February 2011
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Price
$32.00
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