Paper Title:
Adhesion and Electrical Properties of Copper Nitride Films
  Abstract

Copper nitride films were prepared by reactive magnetron sputtering on glass sheets at different deposition conditions. The surface morphology of the films was evaluated by a scanning electron microscope (SEM). The SEM images demonstrate that the films have a compact structure. The structure of the films was characterized by X-ray diffraction (XRD). We focused on the influence of preparation parameters on the adhesion and electrical properties of the films. The metallurgical microscope results indicate that the adhesion of the films enhances with increasing deposition power. The current-voltage (I-V) measurement results show that the resistivity of the films increases with the increasing lattice constants.

  Info
Periodical
Advanced Materials Research (Volumes 197-198)
Edited by
Huaiying Zhou, Tianlong Gu, Daoguo Yang, Zhengyi Jiang, Jianmin Zeng
Pages
344-347
DOI
10.4028/www.scientific.net/AMR.197-198.344
Citation
J. R. Xiao, A. H. Jiang, "Adhesion and Electrical Properties of Copper Nitride Films", Advanced Materials Research, Vols. 197-198, pp. 344-347, 2011
Online since
February 2011
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Price
$32.00
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