Paper Title:
Electroless Plating of Silver on Microorganism Cells
  Abstract

In this paper, microorganism cells (Spirulina platens) were used as forming templates for the fabrication of the helical functional particles with standard shape by electroless silver plating method. The cell form, components and the dielectric properties were observed and analyzed using various tools including optical microscopy, scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and vector network analyzer. The results indicate that the silver coatings on the surfaces of spirulina platensis cells are continuous and compact. The coating thickness of the cells increases with increasing plating time and load, in turn resulting in the increase of the dielectric constant. Furthermore, when the coating thickness is larger than 0.42μm, the samples exhibit significantly percolation phenomenon, indicating that the cells deposited silver form conductive network or electron tunneling in the composites.

  Info
Periodical
Advanced Materials Research (Volumes 197-198)
Edited by
Huaiying Zhou, Tianlong Gu, Daoguo Yang, Zhengyi Jiang, Jianmin Zeng
Pages
531-535
DOI
10.4028/www.scientific.net/AMR.197-198.531
Citation
M. M. Lan, D. Y. Zhang, J. Cai, W. Q. Zhang, H. Y. Li, "Electroless Plating of Silver on Microorganism Cells", Advanced Materials Research, Vols. 197-198, pp. 531-535, 2011
Online since
February 2011
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Price
$32.00
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