Paper Title:
Thermal Design and Analysis of a Satellite Borne Electronic PCB
  Abstract

Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5°C to 72.3°C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.

  Info
Periodical
Advanced Materials Research (Volumes 199-200)
Edited by
Jianmin Zeng, Zhengyi Jiang, Taosen Li, Daoguo Yang and Yun-Hae Kim
Pages
1551-1554
DOI
10.4028/www.scientific.net/AMR.199-200.1551
Citation
B. Chen, "Thermal Design and Analysis of a Satellite Borne Electronic PCB", Advanced Materials Research, Vols. 199-200, pp. 1551-1554, 2011
Online since
February 2011
Authors
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Price
$32.00
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