Paper Title:
Study on the SMT Chip Resistor Solder Joint Two-Dimensional Quality of Information Extraction Based on VC++
  Abstract

This paper introduces the content included in two-dimensional quality information of the SMT solder joint and illustrates the basic principle of extracting two-dimensional information quality of SMT solder joint .By explaining the basic theory and principles and combining with example, the implemention of extracting methods and steps are discussed.The extraction algorithms carry out in VC + + programming, And this lay a good groundwork for follow-up intelligent analysis of solder joint.

  Info
Periodical
Advanced Materials Research (Volumes 201-203)
Edited by
Daoguo Yang, Tianlong Gu, Huaiying Zhou, Jianmin Zeng and Zhengyi Jiang
Pages
704-707
DOI
10.4028/www.scientific.net/AMR.201-203.704
Citation
Y. F. Sun, D. J. Zhou, Q. Zhao, S. H. Zhu, "Study on the SMT Chip Resistor Solder Joint Two-Dimensional Quality of Information Extraction Based on VC++", Advanced Materials Research, Vols. 201-203, pp. 704-707, 2011
Online since
February 2011
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Price
$32.00
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