Paper Title:
The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging
  Abstract

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

  Info
Periodical
Advanced Materials Research (Volumes 211-212)
Edited by
Ran Chen
Pages
638-642
DOI
10.4028/www.scientific.net/AMR.211-212.638
Citation
M. S. Yang, J. W. Liu, L. K. Li, "The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging", Advanced Materials Research, Vols. 211-212, pp. 638-642, 2011
Online since
February 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ming Shan Yang, Yang Liu, Jie He, Lin Kai Li, Ze Wang
Abstract:The melting viscosities of different kinds of epoxy resins have been investigated in this paper. The results showed that tetramethyl biphenyl...
201
Authors: Ming Shan Yang, Lin Kai Li, Jian Guo Zhang
Abstract:The surface modification of silica for epoxy molding compounds (EMC) was conducted by plasma polymerization using RF plasma (13.56MPa), and...
184
Authors: Ming Shan Yang, Lin Kai Li, Yang Liu
Abstract:By means of matching filling of five kinds of spherical silica with the particle size of 2μm, 3μm, 5μm, 10μm, 20μm respectively, the epoxy...
1524
Authors: Ming Shan Yang, Lin Kai Li
Abstract:The hexaphenylamine cyclotriphosphazene (HPACTPZ) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and...
1386
Authors: Ming Shan Yang, Jian Wei Liu, Lin Kai Li
Abstract:The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution...
474