Paper Title:
Control System Research of 2-DOF Precision Positioning Table for IC Packaging
  Abstract

In order to improve the precision and efficiency of IC packaging for wafer wire bonding equipment, a new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward. By establishing dynamic model of VCA and positioning table, the electromechanical coupling control system based on minimum deadbeat response controlling algorithm is proposed. The prototype experiment shows that the new 2-DOF positioning table is robust and of good dynamic performance.

  Info
Periodical
Advanced Materials Research (Volumes 211-212)
Edited by
Ran Chen
Pages
761-765
DOI
10.4028/www.scientific.net/AMR.211-212.761
Citation
X. M. Feng, X. B. Duan, D. W. Zhang, W. K. Liu, A. L. Sun, "Control System Research of 2-DOF Precision Positioning Table for IC Packaging", Advanced Materials Research, Vols. 211-212, pp. 761-765, 2011
Online since
February 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ai Jun Jiang, Kai Wu
Chapter 2: Materials Science in Computer-Aided Manufacturing and Design
Abstract:The stability model was established and the two-dimensional and three-dimensional lobes were plotted for the milling of lateral walls in...
190
Authors: Shan Suo Zheng, Yue Heng Yan, Qing Lin Tao, Wen Yong Li
Chapter 5: Seismic Engineering
Abstract:Based on the experiments of a reinforced concrete frame column, 5 new members with different volumetric percentage of stirrups which are...
2046
Authors: Yan Ying Xu, Song Jian Bao, Yu Lin Wang
Chapter 4: Electronics and Microelectronics, Embedded and Integrated Systems, Communications, Power and Energy, Electric and Magnetic Systems
Abstract:Existed in the work of wireless positioning error, the need to suppress NLOS (Non line of sight) transmission problem of positioning the bad...
1460