Paper Title:
Manufacturing Process Planning to Evaluation on Failure Causes for Lithography Machine: Analytic Hierarchy Process
  Abstract

This study conducted hierarchical analysis on the evaluation item of the stability index of the lithography machine, and established a set of evaluation mechanism for failure prediction, in order to provide references and indicators of troubleshooting for lithography machine. The results showed, when the lithography machine is out of order, the possible failure causes are mainly be found based on the past experiences. Moreover, engineers’ skills in maintenance of lithography machine should be also considered. It is clear that, technology-centered is the current trend in today's semiconductor technology processing. In the weight analysis of rating index for complexity in broken Wafer, the most important problem is the lithography machine error due to failure in its components. Good design and configuration of semiconductor lithography process in the early stage can enhance the rapid maintenance of lithography machine in case of malfunctioning effectively. For timely maintenance, maintaining the organization stringency needs to be improved. This study also found that, under the good configuration of maintenance system, adequate information is closely associated a good system. As for lithography process in semiconductor industry, the complexity of broken Wafer is first considered. Thus, the overall lithography process of semiconductor relies on engineers’ experience. More specifically, a quick error interpretation and repair are required in field maintenance. As in a competitive market of semiconductor processing with high-tech and high-cost, a timely maintenance in the lithography machine is urgent and requested.

  Info
Periodical
Edited by
Zhang Yushu
Pages
450-453
DOI
10.4028/www.scientific.net/AMR.213.450
Citation
P. S. Ko, C. C. Wu, "Manufacturing Process Planning to Evaluation on Failure Causes for Lithography Machine: Analytic Hierarchy Process", Advanced Materials Research, Vol. 213, pp. 450-453, 2011
Online since
February 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: K. Dynefors, V. Desmaris, Joakim Eriksson, Per Åke Nilsson, Niklas Rorsman, Herbert Zirath
1125
Authors: Jae Jong Lee, Seung Woo Lee, Hyun Taek Cho, Gee Hong Kim, Kee Bong Choi
Abstract:The contact-based nanoimprinting lithography (NIL), such as thermal and/or UV nano-imprint, has been well known as one of the next...
441
Authors: Xiao Wei Guo, Qi Ming Dong
Abstract:A low-cost microfabrication tool based on digital mirror device(DMD) is presented in this paper. The imaging principle of the system is...
143
Authors: Mu Jun Li, Hui Chun Ye, Lian Guan Shen
NEMS/MEMS Technology and Devices
Abstract:As an important factor the error of mask pattern is often ignored in the lithography simulation model. To investigate the impact of mask...
3097
Authors: Le Yan, Lei Yin, Hong Zhong Liu
Chapter 29: Nanofabrication, Nanometrology and Applications
Abstract:In this paper, a method of multistep imprint lithography process is described. Through comparing among the loading process factors, a...
7214