Paper Title:
Using Data Envelopment Analysis to Measurement Patent Performance of Medical Instruments Industry
  Abstract

This study analyzes 6,626 patents related to the medical instruments industry, and develops a subsequent patent analysis and performance assessment by means of DEA analysis. From the upper or lower ranking and comparing by DEA models this study found that the mix analysis could provide the results deeply with patents performance of DMUs in medical industries and worth to debate that would be difficult to see in traditional patent analysis. Finally, important elements that influence the performance of DMUs can also be found after sensitivity analysis. This study shows that less input may promote efficient performance while output is equal, but for traditional patent that would be different status with citation rate and R&D capacity. For medical industries’ top companies, they would be more considerate the different character of each correlative variable which have impact for three above input at least for comparison with the others by average efficient score.

  Info
Periodical
Edited by
Zhang Yushu
Pages
454-459
DOI
10.4028/www.scientific.net/AMR.213.454
Citation
S. R. Cheng, C. C. Wu, S. H. Lee Wu, "Using Data Envelopment Analysis to Measurement Patent Performance of Medical Instruments Industry", Advanced Materials Research, Vol. 213, pp. 454-459, 2011
Online since
February 2011
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$32.00
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