Paper Title:
Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern
  Abstract

In order to make the contact pressure distribution of polishing wafer surface more uniform during chemical mechanical polishing (CMP), a kind of the bionic polishing pad with sunflower seed pattern has been designed based on phyllotaxis theory, and the contact model and boundary condition of CMP have been established. Using finite element analysis, the contact pressure distributions between the polishing pad and wafer have been obtained when polishing silicon wafer and the effects of the phyllotactic parameter of polishing pad on the contact pressure distribution are found. The results show that the uniformity of the contact pressure distribution can be improved and the singularity of the contact pressure in the boundary edge of polished wafer can be decreased when the reasonable phyllotactic parameters are selected.

  Info
Periodical
Edited by
Congda Lu
Pages
217-222
DOI
10.4028/www.scientific.net/AMR.215.217
Citation
Y.S. Lv, N. Li, J. Wang, T. Zhang, M. Duan, X. L. Xing, "Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern", Advanced Materials Research, Vol. 215, pp. 217-222, 2011
Online since
March 2011
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