Paper Title:
Thermal Performances Analysis of Microelectronic Chip Cooling System with Thermoelectric Components
  Abstract

The microelectronic chip thermoelectric cooling equipment and its test system have been developed for the deficiency of the conventional cooling technologies in this paper. The thermal resistance analysis model was applied in research the heat transfer process of the microelectronic chip cooling system and its characteristics. The results show that: When the thermoelectric cooling (TEC) system is in normal operating condition,the Peltier effect is the dominant role in the thermoelectric cooling process despite the opposite actions of the Joule and Fourier effects. The thermal resistance of TEC, which is Q2, decreases when the operating current (I) increases. For the different chip power, there is an optimum current (Iopt) making the interface thermal resistance between chip and TEC minimum (Q1). Q1can obtain the minimum 0.465°C·W-1 when the chip power is 25W and Iopt is 2.4A. The total thermal resistance (Qtotal) firstly decreases and then increases with the increase of operating current. There is an optimum current which allows the total thermal resistance is smallest. Qtotal may obtain the minimum value 0.672°C·W-1 when the chip power is 25W and Iopt is 2.4A. Furthermore, Qtotal Iopt both increase by the chip power.

  Info
Periodical
Edited by
Yuhang Yang, Xilong Qu, Yiping Luo and Aimin Yang
Pages
128-133
DOI
10.4028/www.scientific.net/AMR.216.128
Citation
C. H. Wang, J. Y. Zhang, J. Huang, "Thermal Performances Analysis of Microelectronic Chip Cooling System with Thermoelectric Components", Advanced Materials Research, Vol. 216, pp. 128-133, 2011
Online since
March 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Y. He, Zheng Qiang Yao
Abstract:End mills are very widely used in machining metal. In this paper, based on analysis of three different end milling indexable inserts with 3-D...
775
Authors: Li Zhou, Shu Tao Huang
Abstract:In this paper, a transient dynamic finite-element analysis was carried out to investigate the effects of the cutting speed on cutting force,...
220
Authors: Meng Kao Yeh, Chun Lin Lu
Abstract:The thermal expansion mismatch problem for a chip due to temperature decrease from processing temperature to room temperature may cause...
563
Authors: Wern Dare Jheng, Shao Hsien Chen, Zhi Yu Lin
Chapter 5: Materials in Energy and Environment (2)
Abstract:In this study, aluminum nitride, boron nitride, copper, aluminum, with aluminum extruded heat sink as a cooling way of thermoelectric chip....
2974
Authors: Lei Wu, Xiao Yun Xiong, De Xing Wang
Chapter 16: Semiconductor Materials Manufacturing
Abstract:In this study, the junction temperature (Tj) and thermal resistance (Rth) of five high-power multi-chip COB...
1332