Paper Title:
Attached FBG Strain Sensor Based on Thermal Stress Mechanism
  Abstract

Based on a novel thermal stress mechanism, a attached FBG strain sensor with temperature-compensated function was designed and manufactured. This sensor cannot only compensate temperature drift but enhance stain sensitivity. The results are as follows: this package was shown to have a near 2.0 pm/°C shift and a high strain sensitivity of 1.9pm/με in this proposed self-compensated package.

  Info
Periodical
Edited by
Yuhang Yang, Xilong Qu, Yiping Luo and Aimin Yang
Pages
91-95
DOI
10.4028/www.scientific.net/AMR.216.91
Citation
J. Z. Li, Y. L. Du, C.X. Liu, "Attached FBG Strain Sensor Based on Thermal Stress Mechanism", Advanced Materials Research, Vol. 216, pp. 91-95, 2011
Online since
March 2011
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