Paper Title:
Investigation on the Bonding Mechanism of M42 Powder High-Speed Steel and 45 Steel
  Abstract

The sintering of M42 P/M high speed steel followed by jointing to 45 steel had been accomplished at one step by using spark plasma sintering (SPS) technique. Based on the traditional diffusion theory and the designed structure of M42/45 steel joint, the bonding mechanism and models with the interface forming process of the bimetal have been proposed systematcally. The jointing and valuation of M42/45 steel interface are a comprehensive synergy process between fusion and diffusion mechanism. The former one takes priority at the early sintering process, while the later one becomes dominant over the followed sintering process.

  Info
Periodical
Advanced Materials Research (Volumes 217-218)
Edited by
Zhou Mark
Pages
243-248
DOI
10.4028/www.scientific.net/AMR.217-218.243
Citation
H. You, X. R. Wang, C. Liang, X. Q. Ding, X. Y. Han, J. F. Xu, "Investigation on the Bonding Mechanism of M42 Powder High-Speed Steel and 45 Steel", Advanced Materials Research, Vols. 217-218, pp. 243-248, 2011
Online since
March 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Min Yang, Zeng Da Zou, Si Li Song, Xin Hong Wang
Abstract:In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum...
2435
Authors: Akio Nishimoto, Katsuya Akamatsu
Abstract:Pulsed electric current sintering (PECS) was applied to the bonding of W (tungsten) to Cu (copper) using Nb or Ni powder as an intermediate...
289
Authors: José Lemus-Ruiz, Ana L. Salas-Villaseñor, Osvaldo Flores
Abstract:Solid-state direct diffusion bonding between commercially pure nickel and tungsten carbide (with 6%Cobalt) has been carried out in the...
127
Authors: Li Ping Shi, Ye Sheng Zhong, Jia Yu, Xiao Dong He
Abstract:Ti3SiC2 is one of the nano-layered ternary ceramics Mn+1AXn, where M is a transition metal, A is an A-group (mostly IIIA or IVA) element, and...
226
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44