Paper Title:
The Application of Moldflow in Injection Mold Design of Mobile Phone Cover
  Abstract

Based the CAE technology, the paper introduced the application of Moldflow Insight in injection mold design of mobile phone cover. First, we must preprocess the finite element model, including importing three-dimensional model, meshing, and process setting. And then, we can use preliminary simulation analysis to determine the number and location of the gate. Finally to filling, cooling, packing and warpage analysis for part which can help us to find the causes from warpage generated. By optimizing the molding process parameters, adjusting the dwell pressure and the dwell time we can get less warpage, which can meet the precision demand of parts, consequently, the result can provide gist for the mold designers to design and for the injection molding technologist to process parameter adjustment.

  Info
Periodical
Advanced Materials Research (Volumes 228-229)
Edited by
Quanjie Gao
Pages
542-547
DOI
10.4028/www.scientific.net/AMR.228-229.542
Citation
W. J. Zhang, Q. Zhang, "The Application of Moldflow in Injection Mold Design of Mobile Phone Cover", Advanced Materials Research, Vols. 228-229, pp. 542-547, 2011
Online since
April 2011
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Price
$32.00
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