Paper Title:
Characterization of Boron Modified Phenolic Resin and its Curing Behavior
  Abstract

Boron modified phenolic (BPF) resins with different boron amounts were synthesized with a special synthesis technology. The structure of BPF resin was analyzed by Fourier transform infrared spectra (FTIR) and its curing behavior was analyzed by differential scanning calorimeter (DSC). The results showed that boric acid reacted with the hydroxyl groups in phenolic resin to form a new cross-linked bond such as B-O. At the same time, the heat resistance of BPF resin was improved about 18% with addition of boric acid of 0.8wt%. The obtained BPF had a high curing temperature of 254.6when the boric acid amount was 0.8wt%.

  Info
Periodical
Advanced Materials Research (Volumes 233-235)
Edited by
Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He
Pages
137-141
DOI
10.4028/www.scientific.net/AMR.233-235.137
Citation
B. Li, Y. W. Zheng, Z. F. Zheng, X. Y. Zhao, "Characterization of Boron Modified Phenolic Resin and its Curing Behavior", Advanced Materials Research, Vols. 233-235, pp. 137-141, 2011
Online since
May 2011
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Price
$32.00
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