Paper Title:
Curing Kinetics of Octaepoxysilsesquioxane/DDS System
  Abstract

Polyhedral oligomeric silsesquioxane (POSS) can be incorporated into polymers to obtain organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) with eight reactive epoxy groups per molecule is an important kind of POSS. E-POSS was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. The curing kinetics of the E-POSS/DDS system was studied by using differential scanning calorimetry (DSC). Kinssinger and Flynn-Wall-Ozawa methods were used to obtain the activation energy and pre-exponential factor of the curing reaction.

  Info
Periodical
Advanced Materials Research (Volumes 233-235)
Chapter
7 Materials Physics and Materials Chemistry
Edited by
Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He
Pages
1834-1837
DOI
10.4028/www.scientific.net/AMR.233-235.1834
Citation
Z. P. Zhang, J. Z. Pei, S. F. Chen, H. Z. Du, Y. Wen, "Curing Kinetics of Octaepoxysilsesquioxane/DDS System", Advanced Materials Research, Vols. 233-235, pp. 1834-1837, 2011
Online since
May 2011
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Price
$35.00
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