Paper Title:
Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu
  Abstract

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

  Info
Periodical
Advanced Materials Research (Volumes 233-235)
Edited by
Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He
Pages
2323-2327
DOI
10.4028/www.scientific.net/AMR.233-235.2323
Citation
H. Z. Huang, X. Q. Wei, L. Zhou, "Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu", Advanced Materials Research, Vols. 233-235, pp. 2323-2327, 2011
Online since
May 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ja Myeong Koo, Seung Boo Jung
Abstract:The interfacial reactions and bump shear properties of the electroplated Sn-37Pb (in wt.%) solder bumps with the Ni under bump metallization...
181
Authors: Hui Li, Bin Lu
Abstract:The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xEr(x=0, 0.1) solder and Cu...
28
Authors: Kuai Le Zhao, Yan Fu Yan, Yang Yang Sheng, Ning Du, Zhan Lei Liu
Chapter 3: Materials Forming/Machining/Joining
Abstract:Zn20Sn solder with the melting point of 383.9°C and a low cost is considered as an ideal high-temperature lead-free solder. In the paper a...
402
Authors: Jun Feng Qu, Jun Xu, Qiang Hu, Fu Wen Zhang
Chapter 8: Metal Alloy Materials
Abstract:This research investigates the microstructure and growth behavior of the intermetallic compound(IMC) of Sn-1.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu-0.05Ni...
1106
Authors: Mohd Arif Anuar Mohd Salleh, N.S. Ibrahim, N. Saud, A. M. Mustafa Al Bakri, N.Z. Noriman, Ramani Mayapan, Z.A. Ahmad
Abstract:Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems...
797