Paper Title:
Preparation of Hexaphenylamine Cyclotriphosphazene and its Green Flame Retardance on Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging
  Abstract

The hexaphenylamine cyclotriphosphazene (HPACTPZ) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of HPACTPZ was analyzed by FTIR and NMR in this paper. Using HPACTPZ synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by HPACTPZ was up to UL 94 V0 rating(3.2mm) and the oxygen index of the EMC was up to 35.8%, which indicates that HPACTPZ has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, HPACTPZ accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

  Info
Periodical
Advanced Materials Research (Volumes 239-242)
Edited by
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
Pages
1386-1390
DOI
10.4028/www.scientific.net/AMR.239-242.1386
Citation
M. S. Yang, L. K. Li, "Preparation of Hexaphenylamine Cyclotriphosphazene and its Green Flame Retardance on Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging", Advanced Materials Research, Vols. 239-242, pp. 1386-1390, 2011
Online since
May 2011
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Price
$32.00
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