Paper Title:
Mathematic Model of Recrystallization of Cu-20Ni-5Sn Alloy
  Abstract

Research the kinetic mechanism of grain growth of recrystallization of Cu-20Ni-5Sn alloy. The research result shows that the recrystallization temperature declines with the increase of cold-deformation. The recrystallization temperature is at about 500°C ~650°C respectively for 50% and 60% total cold deformation, and is about 470°C ~620°C respectively for 70% and 85% total deformation. The grains grow up with the increase of annealing temperature and holding time. The mathematic model of average grain size can be described as that Cu-20Ni-5Sn alloy annealed at 620°C ~680°C holding 2~10hours.

  Info
Periodical
Advanced Materials Research (Volumes 239-242)
Edited by
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
Pages
2252-2256
DOI
10.4028/www.scientific.net/AMR.239-242.2252
Citation
R. Q. Liu, L. J. Peng, J. S. Yang, "Mathematic Model of Recrystallization of Cu-20Ni-5Sn Alloy", Advanced Materials Research, Vols. 239-242, pp. 2252-2256, 2011
Online since
May 2011
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Price
$32.00
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