Paper Title:
The Activate Processe of Ni-P Electroless Plating on the Surface of SiC Particles
  Abstract

The surface of SiC particles were modified by electroless plating. To avoid complicated activation and sensitization process before nickel-phosphorus chemical plating, a special process was adopted in experiment. After experiments, the metallographic structure was characterized by using SEM and EDS, respectively. The results show that SiC particles modified by Ni-P alloy are obtained after a simple and specific process of SiC particles activation.

  Info
Periodical
Advanced Materials Research (Volumes 239-242)
Edited by
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
Pages
2859-2862
DOI
10.4028/www.scientific.net/AMR.239-242.2859
Citation
J. Y. Hou, D. Yang, "The Activate Processe of Ni-P Electroless Plating on the Surface of SiC Particles", Advanced Materials Research, Vols. 239-242, pp. 2859-2862, 2011
Online since
May 2011
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Price
$32.00
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