Paper Title:
Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes
  Abstract

The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

  Info
Periodical
Advanced Materials Research (Volumes 239-242)
Edited by
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
Pages
2976-2980
DOI
10.4028/www.scientific.net/AMR.239-242.2976
Citation
Y. H. Zhang, J. Qin, H. J. Zhao, G. L. Xu, "Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes", Advanced Materials Research, Vols. 239-242, pp. 2976-2980, 2011
Online since
May 2011
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