Paper Title:
The No-Cyanide Copper Electroplating with Dipping-Plating Pretreatment
  Abstract

The acid dipping-plating pretreatment was applied on iron substrate prior to no-cyanide copper plating process. After being pretreated in dipping solution, the thin copper film formed on iron substrate which could change the cathode electronic potential and enhance the copper plating rate in the follow-up copper electroplating. As a comparation, the iron substrate was directly electroplated in another copper plating bath without dipping-plating pretreatment (DPr). The effects of temperature and electric current density on the copper plating rate were investigated in both process with DPr and process without DPr. And the mechanism was discussed.

  Info
Periodical
Advanced Materials Research (Volumes 239-242)
Edited by
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
Pages
3186-3189
DOI
10.4028/www.scientific.net/AMR.239-242.3186
Citation
X. J. Tang, A. H. Guo, J. G. Wang, M. Gao, B. X. Shen, "The No-Cyanide Copper Electroplating with Dipping-Plating Pretreatment", Advanced Materials Research, Vols. 239-242, pp. 3186-3189, 2011
Online since
May 2011
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Price
$32.00
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