The acid dipping-plating pretreatment was applied on iron substrate prior to no-cyanide copper plating process. After being pretreated in dipping solution, the thin copper film formed on iron substrate which could change the cathode electronic potential and enhance the copper plating rate in the follow-up copper electroplating. As a comparation, the iron substrate was directly electroplated in another copper plating bath without dipping-plating pretreatment (DPr). The effects of temperature and electric current density on the copper plating rate were investigated in both process with DPr and process without DPr. And the mechanism was discussed.