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Precision Surface Finishing and Deburring Technology

Advanced Materials Research Volumes 24 - 25

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• p177 Experimental Study on Cryogenic Polishing Single Silicon Wafer with Nano-Sized Cerium Dioxide Powders   [ 377 K ]
  Authors: Yu Li Sun, Dun Wen Zuo, Yong Wei Zhu, Rong Fa Chen, D.S. Li, M. Wang
• p183 Study on Polishing Rock Minerals of Natural Stone   [ 3 M ]
  Authors: Jian Yun Shen, Xi Peng Xu
• p189 Investigation into LST and its Novel Application in Mould   [ 2 M ]
  Authors: Yun Wang, Z.Y. Xu, Y.H. Fu, Lan Cai
• p195 A Study on Erosion Mechanisms of Quartz Crystals Polished by Micro Abrasive Waterjet   [ 1 M ]
  Authors: Quan Lai Li, Chuan Zhen Huang, Jun Wang, Hong Tao Zhu, Cui Lian Che
• p201 Study on Removal and Embedding Mechanism of CdZnTe Using Loose Abrasive   [ 3 M ]
  Authors: Yan Li, Hang Gao, Ren Ke Kang
• p211 Study on Macro/Micro Complex Feed Mechanism in Dry-ECD Assisted Truing and Dressing of Diamond Wheel   [ 419 K ]
  Authors: Yan Wang, Shi Ming Wang, H. Zhou, De Jin Hu
• p217 Theory and Experiment Study on the Grinding Force   [ 148 K ]
  Authors: Jian Hua Zhang, Pei Qi Ge, L. Zhang
• p223 Research on Stock Removal Uniformity for Double Sided Polishing Process   [ 756 K ]
  Authors: Wei Li, Tian Ming Yu, Xiao Zhen Hu, B. Zhang, Y.H. Zhang
• p229 Study on the Behavior of the Cast-Iron Bonded Grinding Wheel to Machining Properties of Hard and Brittle Materials   [ 1 M ]
  Authors: S.L. Ma, Wei Li, Cong Rong Zhu, J. Zhang, H.C. Ye
• p233 Effects of the Wear Characteristics of Brazed Diamond Grits on Grinding Forces   [ 186 K ]
  Authors: You Ji Zhan, Yuan Li, Hui Huang, Xi Peng Xu
• p239 Experimental Research on Grindability of Aluminum Alloy   [ 306 K ]
  Authors: Suo Xian Yuan, Hui Ding, Wan Shan Wang
• p243 Synthetically Modeling of Thermal Error and Grinding Force Induced Error on a Precision NC Cylindrical Grinding Machine   [ 191 K ]
  Authors: Hao Wu, Jian Guo Yang, Xiu Shan Wang
• p249 Formation and Simulation of Cutting-Direction Burr in Orthogonal Cutting   [ 305 K ]
  Authors: Hai Jun Qu, Gui Cheng Wang, Hong Jie Pei, Qin Feng Li, Yun Ming Zhu
• p255 A Method for Grinding Mode Identification in Grinding of Silicon Wafers   [ 1 M ]
  Authors: Feng Wei Huo, Zhu Ji Jin, Ren Ke Kang, Dong Ming Guo
• p261 Precision Grinding of SUS304 Using Metal Bonded CBN Wheel   [ 294 K ]
  Authors: Y. Hasuda, Y. Suzuki, Y. Tadokoro, S. Kinebuchi, T. Ohashi, T. Furusawa