Paper Title:
Inverse Heat Conduction Problem of the Temperature Field with Artificial Ground Freezing Method
  Abstract

The Artificial Ground Freezing (AGF) Method play an important role in the geotechnical engineering and the back analysis of thermal conductivity of frozen soil is the main inverse heat conduction problem of temperature field. In this paper the physical modelling test of AGF is carried out with double-row-pipe freezing in the lab. According to the measured temperature, the back analysis of thermal conductivity of frozen soil is solved based on the two-dimensional finite element simulation and the least square principle. It is helpful to investigate the freezing process and determine the frozen wall thickness.

  Info
Periodical
Advanced Materials Research (Volumes 243-249)
Edited by
Chaohe Chen, Yong Huang and Guangfan Li
Pages
89-92
DOI
10.4028/www.scientific.net/AMR.243-249.89
Citation
S. L. Xu, "Inverse Heat Conduction Problem of the Temperature Field with Artificial Ground Freezing Method", Advanced Materials Research, Vols. 243-249, pp. 89-92, 2011
Online since
May 2011
Authors
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jun Wang, Hai Xia Wang
Abstract:The quasi-stable state model of one-dimension frost forming process is introduced and solved using numerical methods. The effect of the...
363
Authors: Min Zhang, Jian Hua Chen, Zhen Hua Che, Hui Zhong Zhao, Jian Hua Lu
Abstract:Based on idealized non-steady state transient heat conduction model, the thermal conductivities of apple samples were determined at various...
556
Authors: Shi Wei Liu, Jing Kun Yu, Fei Xiong Mao
Chapter 3: Material Science, Chemistry and Information Technology
Abstract:Torpedo-ladle was widely used in hot metal transportation. As its insulation properties had deep influence on the quality of iron and steel...
444
Authors: Farn Shiun Hwu, Ho Chih Cheng, Ya Hui Hu, Gwo Jiun Sheu
Chapter 2: Machine Parts and Mechanisms. Design and Manufacturing
Abstract:A numerical simulation model to obtain the extra-low internal thermal resistance for submount of LED is presented. The 3-D numerical model...
824
Authors: Fang Qin Yang, Yang Fu Jin, Xin Qian
Chapter 2: Materials and Processing Technologies
Abstract:Heat conductive materials, which are widely used in the fields like electronic information, electrical engineering and aerospace, are...
523