Paper Title:
Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology
  Abstract

The phenolic(PF) foams were prepared used low-temperature foaming and curing method. The optimum low-temperature foaming processing technology conditions and material proportioning were described below. The curing temperature was 40 °C, the amount of foaming agent iso-pentane was 8-10wt.%, tween-80 dosage was 6-7wt.%, the amount of composite curing agent was 15-18wt.%.The effects of low-temperature foaming on mechanical properties, heat insulation, fire-retardant, foam hole form and micro-structure were discussed. 40°C and 70°C curing PF foam performance comparison results showed that low-temperature curing technology slightly affect the fire-retardant properties of PF foam. And excellent overall performance PF foam were prepared with 40°C foaming technology, the foam hole morphology structure, toughness and strength of PF foam were better. In addition, the low-temperature curing PF foam had more even foam hole distribution, more regular foam hole structure, more clean foam hole arrangement.

  Info
Periodical
Advanced Materials Research (Volumes 250-253)
Edited by
Guangfan Li, Yong Huang and Chaohe Chen
Pages
450-454
DOI
10.4028/www.scientific.net/AMR.250-253.450
Citation
X. W. Zhuang, S. H. Li, Y. F. Ma, W. Zhang, Y. Z. Xu, C. P. Wang, F. X. Chu, "Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology", Advanced Materials Research, Vols. 250-253, pp. 450-454, 2011
Online since
May 2011
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Price
$32.00
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