Paper Title:
High Topography Polyimide CMP Process
  Abstract

This paper reports a process of filling and planarization of microstructures for MEMS and wafer level packaging application. In this work, cavities of 5-10mm depth and 20-100mm in length/width are filled using multiple coatings of polyimide with kinematic viscosities in the range of 20-130St. Such filling results in overfilling of polyimide in the range of 2 to 10mm due to variation in density and geometry of microstructure. A chemical and mechanical polishing (CMP) based planarization process, to achieve polyimide thickness variation <0.2mm in varied structures is presented.

  Info
Periodical
Edited by
Lynn Khine and Julius M. Tsai
Pages
107-110
DOI
10.4028/www.scientific.net/AMR.254.107
Citation
Y. J. Mao, G. G. Chen, R. Murthy, S. K. E. Tan, "High Topography Polyimide CMP Process", Advanced Materials Research, Vol. 254, pp. 107-110, 2011
Online since
May 2011
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Price
$32.00
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