Paper Title:
Gapfill Study of Polyimides for MEMS Applications
  Abstract

Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS’ (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical properties and have been commonly used for electrical insulation as well as device passivation and protection. In addition, these organic spin-on polymers serve as excellent sacrificial materials for forming cavities on MEMS structures. This work studies the gapfill properties of several polyimides after spin-coating and curing. In addition, this work examines and compares the gapfilling and planarization properties of a number of different polyimides, including multiple layers of polyimides for gapfilling and planarization.

  Info
Periodical
Edited by
Lynn Khine and Julius M. Tsai
Pages
54-57
DOI
10.4028/www.scientific.net/AMR.254.54
Citation
S. L. H. Jang, W. M. Tan, Y. J. Mao, R. Murthy, N. Ranganathan, "Gapfill Study of Polyimides for MEMS Applications", Advanced Materials Research, Vol. 254, pp. 54-57, 2011
Online since
May 2011
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Price
$32.00
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