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Relationship between Tensile Deformation and Crystallographic Orientation of Grains in the Balanced Al-Mg2 Si Alloys

Journal Advanced Materials Research (Volumes 26 - 28)
Volume Advanced Materials and Processing
Edited by Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages 125-128
DOI 10.4028/www.scientific.net/AMR.26-28.125
Citation Katsunari Horiba et al., 2007, Advanced Materials Research, 26-28, 125
Online since October, 2007
Authors Katsunari Horiba, Junji Tsukiyama, Kenji Matsuda, Yasuhiro Uetani, Susumu Ikeno
Keywords Al-Mg2Si, Electron Backscattered Pattern (EBSP), Rolled, Tensile Test, Thermomechanical Treatment
Abstract

Heat-treatable 6000-series alloys are currently used by automotive body sheets. It is general to improve mechanical properties of the Al-Mg-Si alloy by giving addition of the element and the thermo-mechanical treatment. The electron backscattered pattern (EBSP) technique has been performed in order to analyse individual crystallographic orientation in these alloys. Hardness of the 30%-rolled alloy was higher than that of the 0%-rolled alloy. The Schmid factor of individual crystal grain was calculated by crystallographic orientation. After adding a little deformation, the crack was observed at the interface between higher SF and lower SF grains. It was thought that this crack introduced a fracture from the surface.

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