Paper Title:
ECCI Observation of Dislocation Structure Formed around an Intergranular Fatigue Crack in Copper
  Abstract

A fatigue crack growth test was conducted in a polycrystalline copper. Dislocation structure formed near an intergranular fatigue crack was investigated by electron channelling contrast imaging (ECCI) method. The ECCI method enables us to observe dislocations lying under surface using a scanning electron microscope. The fatigue crack in the copper specimen was grown along both grain boundaries and slip bands inside grain. The ECCI observations revealed that both the vein dislocation structure and the cell structures were formed near the grain boundaries. The formations of different dislocation structures near boundaries could be interpreted in terms of the plastic strain incompatibility.

  Info
Periodical
Advanced Materials Research (Volumes 26-28)
Edited by
Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages
1317-1320
DOI
10.4028/www.scientific.net/AMR.26-28.1317
Citation
Y. Kaneko, M. Ishikawa, S. Hashimoto, "ECCI Observation of Dislocation Structure Formed around an Intergranular Fatigue Crack in Copper", Advanced Materials Research, Vols. 26-28, pp. 1317-1320, 2007
Online since
October 2007
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Price
$32.00
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