Paper Title:
A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting
  Abstract

Thermal fracture-cutting technology (TFCT) for brittle materials has become the main technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement. Based on the thermal weight function principle of fracture mechanics, this paper presents thermal weight function distributions for the mode-I and mode-II fracture model, and the fracture phenomenon under a variety of cutting paths, such as tilt crack, split crack, twist crack, and local buckling.

  Info
Periodical
Advanced Materials Research (Volumes 264-265)
Edited by
M.S.J. Hashmi, S. Mridha and S. Naher
Pages
1252-1257
DOI
10.4028/www.scientific.net/AMR.264-265.1252
Citation
K. C. Huang, M. W. Hung, S. F. Tseng, C. H. Hwang, "A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting", Advanced Materials Research, Vols. 264-265, pp. 1252-1257, 2011
Online since
June 2011
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Price
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