Paper Title:
Application of Finite Element Method in Optimal Design of Flip-Chip Package
  Abstract

More and more solder joints in circuit boards and electronic products are changing to lead free solder, placing an emphasis on lead free solder joint reliability. Solder joint fatigue failure is a serious reliability concern in area array technologies. In this study, the effects of substrate materials on the solder joint thermal fatigue life were investigated by finite element model. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints. The thermal strain/stress in solder joints of flip chip assemblies with different substrates was compared, and the fatigue life of solder joints were evaluated by Darveaux’s crack initiation and growth model. The results show the mechanisms of substrate flexibility on improving solder joint thermal fatigue.

  Info
Periodical
Advanced Materials Research (Volumes 264-265)
Edited by
M.S.J. Hashmi, S. Mridha and S. Naher
Pages
1660-1665
DOI
10.4028/www.scientific.net/AMR.264-265.1660
Citation
Y. C. Lin, Y. C. Xia, "Application of Finite Element Method in Optimal Design of Flip-Chip Package", Advanced Materials Research, Vols. 264-265, pp. 1660-1665, 2011
Online since
June 2011
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Price
$32.00
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