Paper Title:
Heat Transfer Enhancement of Copper-Water Nanofluids in a Lid-Driven Enclosure with Two Mutually Orthogonal Heated Plates
  Abstract

This paper presents the results of a numerical study on the mixed convection in a lid-driven enclosure filled with a copper-water nanofluid and induced by two mutually orthogonal heated thin plates. Two different boundary conditions (isothermal boundary condition and isoflux boundary condition) are considered. The coupled gonverning equations are solved numerically by a fully fourth-order accurate compact finite difference method. A parametric study is conducted and a set of graphical results is presented and discussed to elucidate that significant heat transfer enhancement can be obtained due to the presence of nanoparticles.

  Info
Periodical
Advanced Materials Research (Volumes 268-270)
Edited by
Feng Xiong
Pages
263-268
DOI
10.4028/www.scientific.net/AMR.268-270.263
Citation
X. F. Wang, D. F. Li, F. Hui, "Heat Transfer Enhancement of Copper-Water Nanofluids in a Lid-Driven Enclosure with Two Mutually Orthogonal Heated Plates", Advanced Materials Research, Vols. 268-270, pp. 263-268, 2011
Online since
July 2011
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