Paper Title:
Phase Composition, Microstructure and Thermal Diffusivity of Cu/Si Composites Sintering Temperature Dependence
  Abstract

Cu/Si composites may become novel high-performance electronic packaging materials owing to combining the advantages of copper and silicon components. Here, we prepared Cu/Si composites by being sintered below and above eutectic temperature 802 °C, respectively, and found that sintering temperature notably affects their composition, microstructure and thermal diffusivity. The composites sintered at 780 °C are composed of copper and silicon, exhibiting dispersed silicon particles and continuous copper matrix, but those sintered at 820 °C primarily contain Cu3Si compounds, and a porous microstructure is observed. The thermal diffusivity of the former is over 21 times higher than that of the latter.

  Info
Periodical
Edited by
George Ferguson, Ashvin Thambyah, Michael A Hodgson and Kelly Wade
Pages
200-203
DOI
10.4028/www.scientific.net/AMR.275.200
Citation
H. Cai, Y. P. Wang, X. P. Song, B. J. Ding, "Phase Composition, Microstructure and Thermal Diffusivity of Cu/Si Composites Sintering Temperature Dependence", Advanced Materials Research, Vol. 275, pp. 200-203, 2011
Online since
July 2011
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$32.00
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