Paper Title:
On-Chip Tensile Testing of the Mechanical and Electro-Mechanical Properties of Nano-Scale Silicon Free-Standing Beams
  Abstract

A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations.

  Info
Periodical
Edited by
Alexei N. Nazarov and Jean-Pierre Raskin
Pages
117-126
DOI
10.4028/www.scientific.net/AMR.276.117
Citation
U. Bhaskar, V. Passi, A. Zulfiqar, U. Södervall, B. Nilsson, G. Petersson, M. Hagberg, T. Pardoen, J. P. Raskin, "On-Chip Tensile Testing of the Mechanical and Electro-Mechanical Properties of Nano-Scale Silicon Free-Standing Beams", Advanced Materials Research, Vol. 276, pp. 117-126, 2011
Online since
July 2011
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Price
$32.00
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