Paper Title:
Research on MID Application in RFID Based on Intelligent Materials
  Abstract

In this paper, the three-dimensional molding mechanical and electrical integration unit Molded Interconnect Devices (MID) is introduced. It is a new type of electronic component. And the following part of the article presents the Internet of Things (IOT). From the design and manufacture process, the paper describes the possibility and necessity using MID in IOT technology, as RFID and Embedded System. In the end, the MID design process is presented.

  Info
Periodical
Advanced Materials Research (Volumes 282-283)
Chapter
Chapter2: Material Science, Environment Science and Engineering
Edited by
Helen Zhang and David Jin
Pages
244-247
DOI
10.4028/www.scientific.net/AMR.282-283.244
Citation
W. J. Xu, "Research on MID Application in RFID Based on Intelligent Materials", Advanced Materials Research, Vols. 282-283, pp. 244-247, 2011
Online since
July 2011
Authors
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Price
$32.00
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