Paper Title:
High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing
  Abstract

High-temperature resistant epoxy adhesives cured under room-temperature becomes more and more important in many industries such as aerospace and aviation, the locomotive and diesel, etc. In this paper three self-made amine-based mannich-amide was mixed with E-44 epoxy resin under the same technological parameters, and the epoxy adhesives cured by the three amine-based mannich-amides under room-temperature are tested by FTIR, TGA and DMA. Results of TGA show a quicker drop in weight occurrence within 150-250°C for epoxy networks cured by multiamine-based mannich amides than the long-chain alkyl one. Results of FTIR show completely curing of epoxy adhesives cured by mannich amides under room temperature and the height of absorption band 1502cm-1 (C-N) is much lower after 12h under 150°C,200°C atmosphere than 25°C. Results of DMA show that the Tg determined by DMA has an order EP AN2(89.9°C) >EP AN1(89.7°C)>EP AN3(80.8°C). In the rest results of DMA, the EP-AN3 system has the biggest storage modulus (E’) within 100-150°C while the EP-AN3 system has the smallest loss modulus(E”) within 100-150°C. As a whole, the epoxy adhesives cured by AN3 under room-temperature have the best high temperature resistance.

  Info
Periodical
Advanced Materials Research (Volumes 284-286)
Chapter
Biomaterials
Edited by
Xiaoming Sang, Pengcheng Wang, Liqun Ai, Yungang Li and Jinglong Bu
Pages
1804-1807
DOI
10.4028/www.scientific.net/AMR.284-286.1804
Citation
D. L. Ran, J. J. Xie, K. Huang, S. P. Yin, S. M. Chen, Y. S. Luo, "High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing", Advanced Materials Research, Vols. 284-286, pp. 1804-1807, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yan Qin, Jin Rong Jia, Zhi Xiong Huang
Polymer Materials
Abstract:A new two-component polyurethane adhesive was prepared with castor oil used as main agent and castor oil modified TDI used as curing...
1128
Authors: Ming Ming Yu, Bin Feng, Min Yang, Li Qi Liu, Hong Li, Mu Su Ren, Jin Liang Sun, Jia Bao Zhang
Chapter 1: Materials Processing Technologies and Analysis, Materials Engineering
Abstract:In order to improve the toughness of the cured aromatic tetrafunctional epoxy resins in the premise of influencing the thermal properties as...
107
Authors: Gong Wen Tang, Zhi Shan Yan, Xin Huang
Chapter 3: Organic and Polymer Functional Materials
Abstract:As worldwide environmental and ecological regulations become strict, water soluble system presents great potential in the new VOC-compliant,...
639