Paper Title:
Enhancement of Thermal Conductivity with Carbon-Encapsulated Copper Nano-Particle for Nanofluids
  Abstract

Carbon-encapsulated copper nanoparticles were synthesized by a carbon arc discharge method. The particles were characterized in detail by transmission electron microscope, high-resolution transmission electron microscopy, thermogravimetric and differential scanning calorimetry. The result showed that the outside graphitic carbon layers effectively prevented unwanted oxidation of the copper inside. The dispersion behaviors and thermal conductivity of Carbon-encapsulated copper nanoparticles in water with different dispersants were investigated under different pH values. The results showed that the dispersion and thermal conductivity enhancements of Carbon-encapsulated copper nanoparticles nanofluids are higher than that of copper nanoparticles.

  Info
Periodical
Advanced Materials Research (Volumes 284-286)
Chapter
Micro/Nano Materials
Edited by
Xiaoming Sang, Pengcheng Wang, Liqun Ai, Yungang Li and Jinglong Bu
Pages
801-805
DOI
10.4028/www.scientific.net/AMR.284-286.801
Citation
J. S. Pang, H. Y. Zhang, L. P. Li, "Enhancement of Thermal Conductivity with Carbon-Encapsulated Copper Nano-Particle for Nanofluids", Advanced Materials Research, Vols. 284-286, pp. 801-805, 2011
Online since
July 2011
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Price
$32.00
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