Paper Title:
Isothermal Physical Aging of Poly(ethyl methacrylate)/Polyhedral Oligomeric Silsequioxanes Nanocomposite Thin Films
  Abstract

The effects of the polyhedral oligomeric silsequioxanes (POSS) in stacked poly(methyl methacrylate) (PMMA) film samples were investigated in two different film thicknesses, ~50 and ~660 nm. The types of the POSS include methacryl-, octaisobutyl-, and octasilane-POSS. The glass transition temperature (Tg) and isothermal physical aging was depressed by the reduction of film thickness. Among POSS molecules used in this work, methacryl-POSS was the greatest effect in both Tg and relaxation enthalpy (DHRelax) due to the physical aging. The Kohlrausch-Williams-Watts (KWW) relaxation function was used to further understand the effect of POSS and film thickness on the physical aging.

  Info
Periodical
Advanced Materials Research (Volumes 287-290)
Chapter
Thin Films
Edited by
Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li
Pages
2234-2239
DOI
10.4028/www.scientific.net/AMR.287-290.2234
Citation
S. R. Jin, J. K. Lee, "Isothermal Physical Aging of Poly(ethyl methacrylate)/Polyhedral Oligomeric Silsequioxanes Nanocomposite Thin Films", Advanced Materials Research, Vols. 287-290, pp. 2234-2239, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Wen Bo Luo, Xin Tang, Rong Guo Zhao, Jiang Hua Tan, Yoshihiro Tomita
Abstract:In this work, the physical aging and its effect on nonlinear creep behavior of poly(methyl methacrylate) are presented. After annealing...
2041
Authors: Wen Bo Luo, Chu Hong Wang, Xiu Liu, Qiang Shen
Mechanical Behavior & Fracture
Abstract:The influence of physical aging on mechanical properties of glassy polymers was investigated in this paper. After annealing above...
914
Authors: Norainiza Saud, Flora Somidin, Najib Saedi Ibrahim, Mohd Arif Anuar Mohd Salleh
Chapter 9: Materials and Technologies in Electronics and Optoelectronics
Abstract:The intermetallic compounds (IMCs) layer formed between Sn-0.7Cu-1.0wt.%Si3N4 (SC-1.0SN) solder and Cu-substrate were...
577