Paper Title:
Thermal Stability of Cu/Si (111) Films Prepared by Ionized Cluster Beam Technique
  Abstract

The Cu films were deposited on P type Si (111) substrates by ionized cluster beam (ICB) technique. The interface reaction and atomic diffusion of Cu/Si (111) system were studied at different annealing temperatures by X-ray diffraction (XRD) and Rutherford backscattering spectrometry (RBS). Some significant results were obtained: For the Cu/Si (111) samples prepared by ionized cluster beams at Va=3 kV, the interdiffusion of Cu and Si atoms occurred in the as deposited samples. The RBS spectra features were changed with a very small extent with increasing the annealing temperature. There are no copper-silicide phases observed by XRD before and after being annealed at different temperatures. The reason may be that there is a thermally stable interface between Cu films and Si substrates formed.

  Info
Periodical
Advanced Materials Research (Volumes 287-290)
Chapter
Thin Films
Edited by
Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li
Pages
2369-2372
DOI
10.4028/www.scientific.net/AMR.287-290.2369
Citation
B. Cao, Y. H. Jia, G. P. Li, S. J. Cho, H. Kim, "Thermal Stability of Cu/Si (111) Films Prepared by Ionized Cluster Beam Technique", Advanced Materials Research, Vols. 287-290, pp. 2369-2372, 2011
Online since
July 2011
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Price
$32.00
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