Paper Title:
Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties
  Abstract

RPSL-01 type photosensitive resin for Stereolithography was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), tripropylene glycol diacrylate (TPGDA), pentaerythritol triacrylate(PETA), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 425mPa.S, The glass transition temperature (Tg ) of the UV-cured specimen was 47°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

  Info
Periodical
Advanced Materials Research (Volumes 287-290)
Chapter
New Functional Materials
Edited by
Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li
Pages
386-389
DOI
10.4028/www.scientific.net/AMR.287-290.386
Citation
B. W. Huang, Z. X. Weng, S. M. Liu, W. Q. Chen, "Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties", Advanced Materials Research, Vols. 287-290, pp. 386-389, 2011
Online since
July 2011
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Price
$32.00
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