Paper Title:
Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias
  Abstract

Light Emitting Diode (LED) has been already familiar that is used as lighting sources of general electronic devices and various displays. LED has many advantages such as long life, low power consumption and high reliability. In the future, as alternative to fluorescent lighting, it is sure that LED in lighting products is expected to receive much attention. However, the components related with advanced LED packages or modules have been issued on the heat from LED chip. And the LED chip is still being developed to the high power devices which are generating more heat. In this study, we investigated the variation of thermal resistance in LED modules embedded with thermal via. Through the analysis of thermal resistance with various test vehicles, we could obtain the concrete relationship between thermal resistance and structure of thermal via.

  Info
Periodical
Advanced Materials Research (Volumes 287-290)
Chapter
Building Materials
Edited by
Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li
Pages
789-792
DOI
10.4028/www.scientific.net/AMR.287-290.789
Citation
H. W. Shin, H. S. Lee, S. B. Jung, "Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias", Advanced Materials Research, Vols. 287-290, pp. 789-792, 2011
Online since
July 2011
Export
Price
$32.00
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